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Substrate Inspection Apparatus
The test system of the printed circuit board (mounting board) called the flying probe tester developed ahead of the world received high evaluation at the electronics manufacturing factory around the world, securing the top share of the industry and "Takaya of the board tester" We have established a firm position that.
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GaN substrates
Sumitomo Electric Industries, Ltd.
Gallium Nitride (GaN) substrates are widely used for optical devices in the blue-violate to green ranges due to their excellent material characteristics. In recent years, GaN substrates have been drawing attention for power devices. Many development projects are underway.
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Coating Thickness Meter for Ferrous Substrates
CM8821
- Operating principle: magnetic induction (F)- Measuring range:0-1000um - Resolution; 0.1/1- Accuracy: 鍗?-3%n or 鍗?.5um- Min. measuring area: 6mm- Min. sample thickness: 0.3mm- Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AA (UM-3) battery- Auto power off- Operating conditions:0-+45閳?/span>(32閳?/span>-104閳?/span>),閳?0%RH- Dimensions: 160x68x32mm- weight: 250g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Substrate Thickness, Warp, and TTV Measurement
413 Series
Substrate Thickness, Warp, and TTV Measurement- with or without Tape- for Wafer Backgrind and Etch Thinning processes.Non-contact Echoprobe Technology.Thin film and surface roughness options.
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Coating Thickness Meter for Ferrous and Non-Ferrous Substrates
CM8822
- Operating principle: magnetic induction/eddy current (F/NF)- Measuring range:0-1000um- Resolution; 0.1/1- Accuracy: 卤1-3%n or 卤2.5um- Min. measuring area: 6mm- Min. sample thickness: 0.3mm - Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AA(UM-3)battery- Auto power off- Operating conditions:0-+45鈩?/span>(32鈩?/span>-104鈩?/span>),鈮?0%RH- Dimensions: 160x68x32mm- weight: 250g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Large Substrate Mask Aligner
Model 6020
The Model 6020 is a large substrate Production Mask Aligner or Auto-flood Exposure System for RDL First Level Advanced Packaging (PLP) and markets requiring exposure of large glass panels. It is engineered with OAI’s precision, reliability, and quality that is found in all of OAI’s products. The features include wedge effect leveling, superb process repeatability, ≤ 2.0µm printing resolution, and remote diagnostics. Using robotic handling, the system can stand alone or be fully integrated with photo resist processing.
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Plano Optical Substrate Fabrication
Keysight has the technology and expertise to fulfill all your requirements for precision plano substrates up to 300mm:
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Fully Automatic Test Machine for Ceramic Substrates
U800CCT
1. CCD automatic alignment, with an accuracy of ± 10μm2. Support layout test, displacement function3. The upper and lower jigs X, Y, θ are automatically fine-tuned to improve the yield4. Automatic loading and unloading of magazine5. Automatic bad marking and verification of scratches
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High Volume Semiconductor Substrate Interconnect Tester
GATS-2100
Pre-align *load *CCD camera alignment *electrical test * unload * sort of pass, opens, shorts, and alignment errors.The GATS-2100 concurrent approach provides unmatched volume capability... 2.5 seconds per device. As with all Nidec-Read Test systems, the GATS-2100 offers you the most test technologies for your requirements
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Semi-auto 4 Point Probe System for Solar Cell Substrate
RG-100PV
*Measurement system for thin film on substrate samples for multi-points measurement*Even pitch and random pitch for Max.1,000 points*2-D/3-D square mapping software for even pitch
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Fastest Flying Probe Test System for Semiconductor Substrate Interconnect Test
GATS-3200
* Test individual packages or * Test Multi-image panels with Step&Repeat Function * single flying probe top using very high speed voice coil motor (VCM) technology * 50 - 100 tests per second ... high throughput * Dual Flying Probe Top for testing bump-to-bump nets * flying probe head allows testing of all nets including each power and ground point * 4-wire test capability
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Coating Thickness Meter for Automobiles - Ferrous and Non-Ferrous Substrates
CM8828FN
- Operating principle: magnetic induction/eddy current (F/NF)- Measuring range:0-1250um/0-50mil- Resolution; 0.1/1- Accuracy: 卤1-3%n or 卤2.5um- Min. measuring area: 6mm - Min. sample thickness: 0.3mm- Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AAA(UM-4)battery- Auto power off- Operating conditions:0-+45鈩?/span>(32鈩?/span>-104鈩?/span>),鈮?0%RH- Dimensions: 126x65x27mm- weight: 81g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Non-contact Inline Sheet Resistance Measurement Module For Conductive Layer On Substrate
NC-700
*Inline measurement module for moving substrates such as PET film, glass or paper*Continuous measurement(~24h) in Roll to Roll with OFF-SET FREE capability system*Various applications from the research and development to the production line
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Coating Thickness Meter for Ferrous and Non-Ferrous Substrates
CM8829
- Operating principle: magnetic induction/eddy current (F/NF)- Measuring range:0-1250um/0-50mil- Resolution; 0.1/1- Accuracy: 閸?-3%n or 閸?.5um- Min. measuring area: 6mm- Min. sample thickness: 0.3mm- Battery indicator: low battery indicator- Metric/ imperial: convertible- Power supply: 4x1.5V AAA(UM-4)battery- Auto power off- Operating conditions:0-+45闁?/span>(32闁?/span>-104闁?/span>),闁?0%RH- Dimensions: 126x65x27mm- weight: 81g(not including battery)- Optional accessories: other range 0-200um to 15000um
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Flying Probe Tester Substrate
Substrates with structures down to 10µm and several hundred thousand test points per panel require specific solutions forscanningcapacitance measurementhigh accuracy and temperature Management
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SERS (Surface Enhanced Raman Scattering) Substrate & SERS Reader – Mini Chemistry Analytic Pack
The porous carbon SERS substrate provides not only high signal enhancement due to its strong broadband charge-transfer resonance for large chemical enhancement (as opposed to electromagnetic enhancement in traditional metal-based SERS substrates), but also extraordinarily high reproducibility or substrate-to-substrate, spot-to-spot, sample-to-sample, and time-to-time consistency in SERS spectrum (which is not possible with traditional metal-based SERS) due to the absence of "electromagnetic hot spots" by making the entire surface of the substrate "chemically hot", high durability due to no oxidization, and high compatibility to biomolecules due to its fluorescence quenching capability.
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Calibration Substrates
The GGB Industries, Inc., line of CALIBRATION SUBSTRATES allows the user to calibrate any GGB Industries, Inc., microwave Picoprobe® at the probe tip. The underlying principal of the calibration of a measurement system is to provide accurate known standards to which the measurement system can be connected
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Substrate Manufacturing
KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
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Differential Calibration Substrates
The GGB Industries, Inc., line of DIFFERENTIAL CALIBRATION SUBSTRATES allows the user to calibrate any GGB Industries, Inc., microwave Picoprobe at the probe tip. The underlying principal of the calibration of a measurement system is to provide accurate known standards to which the measurement system can be connected.
